Title:
PACKAGING OF THERMOPLASTIC COMPOSITION USING THERMALLY CONDUCTIVE RIGID MOLD
Document Type and Number:
Japanese Patent JPH09125044
Kind Code:
A
Abstract:
To continuously package a thermoplastic composition such as a pressure-sensitive, hot-melt type adhesive.
A thermoplastic composition is continuously packaged as follows: (a) forming a rigid mold with a thermoplastic layer (where this mold layer is melted at a temperature lower than that at which the hot-melt type adhesive composition is used and the mold is exposed to the surrounding air): (b) distributing the hot-melt adhesive composition into the mold whose inside is lined: (c) arranging a thermoplastic layer to the surface of the mold to form a packaged hot-melt adhesive composition: (d) making the packaged hot-melt adhesive composition removable from the mold in the ambient air.
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Inventors:
MARUKOMU TEIRAA
JIYOOJI BEITOSON
BURAIAN POSUNAA
GUREN HOIYAA
JIYOOJI BEITOSON
BURAIAN POSUNAA
GUREN HOIYAA
Application Number:
JP14633696A
Publication Date:
May 13, 1997
Filing Date:
June 07, 1996
Export Citation:
Assignee:
FULLER H B LICENSING FINANC
International Classes:
B29C39/26; B29B13/02; B29C39/06; B29C39/18; B65B9/04; B65B63/08; C09J201/00; (IPC1-7): C09J201/00; B29C39/06; B29C39/18; B29C39/26
Attorney, Agent or Firm:
Kamoda Asao
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