Title:
PACKING METHOD FOR HOT-MELT ADHESIVE
Document Type and Number:
Japanese Patent JP3731157
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a packing method for hot-melt adhesive hardly causing damage of a surface protective resin for package and leakage of the adhesive, hardly causing deformation of a packed item, hardly deteriorating the quality of the hot-melt adhesive by the surface protective resin for package and cheaply effectively packing the hot-melt adhesive with the surface protective resin for package.
SOLUTION: In the packing method for the hot-melt adhesive, the adhesive and a surface protective resin are separately melted by set of a main extruder 1 and a sub-extruder 2 or set of a pump and an extruder. Both the melted resin and adhesive are joined to a common extruding head portion 3 in their pasty state and then the adhesive is directly continuously packed with the cylindrical surface protective resin.
Inventors:
Katsuyoshi Wang
Application Number:
JP2002132495A
Publication Date:
January 05, 2006
Filing Date:
May 08, 2002
Export Citation:
Assignee:
Seitai Industrial Technology Co., Ltd.
International Classes:
B65B9/24; B65B63/08; B29C47/00; B65B33/02; B65B61/24; (IPC1-7): B65B63/08; B29C47/00; B65B9/24; B65B33/02
Domestic Patent References:
| JP4294718A | ||||
| JP11507899A | ||||
| JP7507986A | ||||
| JP2001503791A |
Attorney, Agent or Firm:
Sakuo Yamaguchi
Tetsuya Mori
Yoshiaki Naito
Cui Shu Tetsu
Tetsuya Mori
Yoshiaki Naito
Cui Shu Tetsu
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