PURPOSE: To enable a pad grid array package to be enhanced in connection reliability by a method wherein ultraviolet-curing conductive resin is applied onto a mounting board, the pad grid array package is mounted on the upside of the mounting board at a specified point, ultraviolet rays are made to irradiate through a through-hole to cure the applied conductive resin, and the uncured part is removed.

CONSTITUTION: A pad grid array package 1 is provided with a conductor pad 4 and a through-hole 3 to be electrically connected to the outside. A circuit board 2 is composed of a copper pad 7 connected to the package 1, a solder resist 8 which protects a wiring, and a glass cloth epoxy board 9 which serves as a base. A ultraviolet-curing conductive liquid resin 6 is applied onto the upside of the circuit board 2, the pad grid array package 1 is placed on the circuit board at a specified point, and ultraviolet rays are made to irradiate through the through-hole 3 from above to cure the resin 6 located below. The uncured part of the resin 6 not irradiated with ultraviolet rays is removed, and thus a pad grid array package is mounted on a board.