Title:
パネル成形装置及び成形方法
Document Type and Number:
Japanese Patent JP4879315
Kind Code:
B2
Abstract:
Disclosed herein is an apparatus and method for forming a panel. The apparatus includes a first mold unit may include a right-angled upper mold provided on the front portion of an upper mold to reciprocate vertically, and a right-angled lower mold provided on the front portion of a lower mold, thus compressing base materials to impart a pattern of a right triangular waveform. A second mold unit may include an obtuse upper mold provided on the central portion of the upper mold to reciprocate in a direction inclined relative to a progressing direction of the base materials, and an obtuse lower mold provided on the central portion of the lower mold, thus compressing the base materials to impart a pattern of an obtuse triangular waveform. A third mold unit may be provided behind the second mold unit and linearly presses the base materials in a direction from front to rear.
Inventors:
Liang
Application Number:
JP2009286565A
Publication Date:
February 22, 2012
Filing Date:
December 17, 2009
Export Citation:
Assignee:
Micro Contact Solution Co., Ltd.
International Classes:
B21D13/02; B21D39/03
Domestic Patent References:
| JP2001170711A |
Foreign References:
| KR1020080011914A |
Attorney, Agent or Firm:
Tadahiko Ito
Shinsuke Onuki
Tadashige Ito
Shinsuke Onuki
Tadashige Ito