Title:
熱伝導防止板が備えられた紙コップ
Document Type and Number:
Japanese Patent JP7104990
Kind Code:
B2
Abstract:
The present invention relates to a paper cup provided with a heat conduction prevention plate. The paper cup is provided integrally with a heat conduction prevention plate by being attached to the paper cup, and thus it is not necessary for a user to frequently insert a separate heat conduction prevention plate into the paper cup when drinking a drink. Also, a certain space is formed between the integrated heat conduction prevention plate and the paper cup body, thereby effectively performing a heat conduction blocking function. Moreover, since the heat conduction prevention plate is provided in an area that can be held by a finger, it is possible to be manufactured at a low manufacturing cost, and the paper cup widens toward the top, so that the paper cup slips less from fingers.
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| WO/2013/102770 | CUP FOR TEA |
Inventors:
KANG, Kyung Wook
Application Number:
JP2019543288A
Publication Date:
July 22, 2022
Filing Date:
February 14, 2018
Export Citation:
Assignee:
KANG, Kyung Wook
International Classes:
A47G19/22; A47G19/00; A47G23/02; B65D3/28; B65D25/36; B65D81/38
Domestic Patent References:
| JP7040961A | ||||
| JP2001240152A |
Foreign References:
| KR1020120045206A | ||||
| KR20030024332A | ||||
| KR2020080004515U | ||||
| WO1997048315A1 | ||||
| KR1020150106089A | ||||
| KR20000009282A |
Attorney, Agent or Firm:
Shigeki Orisaka
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