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Patent Searching and Data


Title:
PART MOUNTING METHOD AND PART MOUNTING SYSTEM
Document Type and Number:
Japanese Patent JP2008166637
Kind Code:
A
Abstract:

To automate the retooling work of a mounting line in a part mounting method and a part mounting system by which parts are mounted to circuit boards such as a printed board or the like.

The mounting line 25 mounting electronic parts 20 to 23 on a printed board 10 is constituted of an IC tag reader 29, part mounting equipment 33, a reflow system 35, a part supply unit 37 or the like. On the printed board 10, there are provided the respective board IC tags 16a to 16d storing the part mounting information (part name information and location information) of the mounted electronic parts 20 to 23. The part mounting information stored in each board IC tag 16a to 16d is read by the IC tag reader 29. A mount program is prepared based on the part mounting information. The part mounting equipment 33 mounts respective electronic parts 20 to 23 on the printed board 10 according to the mount program. Whenever a form of the printed board 10 is exchanged, a new mount program is prepared to make it possible to mount the electronic parts 20 to 23, and consequently the retooling work of the mounting line 25 can be automated.


Inventors:
SAGIYA HIROSHI
Application Number:
JP2007000074A
Publication Date:
July 17, 2008
Filing Date:
January 04, 2007
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
H05K13/04
Attorney, Agent or Firm:
Kazunori Kobayashi
Shigeru Iijima
Kobayashi Hideyoshi