PURPOSE: To apply partially a plating of the pattern of a complicated shape to the surface of a synthetic resin, by partially printing and applying a specified high-molecular compound to the surface of a synthetic resin and then subjecting the surface to a roughening treatment, chemical plating and electroplating.

CONSTITUTION: A platable synthetic resin (e.g., ABS resin) 1 is subjected to a surface refinement 2 and chemical etching 3, and then the part of the resin which must be left unplated is printed and coated 4 with a high-molecular compound solution which can resist roughening with a surface-roughening solution, e.g., epoxy ink, and then dried. Then, this is subjected to a surface refinement 5 and then etched 6 with a surface-roughening solution to roughen only the exposed part of the resin ground, then subjected to a catalyzer treatment 7, and accelerator treatment 8, and then subjected to chemical nickel plating 9 or chemical copper plating 10 and finally to electroplating 11.

EFFECT: It is possible to equalize the application thickness of the high-molecular compound to the thickness of plating, so that it becomes possible to obtain a synthetic resin having an irregularity-free surface.