Title:
PARTICLE BOARD
Document Type and Number:
Japanese Patent JP2015157456
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a particle board in which dimensional stability is satisfactory and reduction in cost can be attained.SOLUTION: Provided is a particle board comprising: bamboo chips obtained by pulverizing a bamboo with a fiber ratio of 50 wt.% or higher, preferably, of 53 to 60 wt.%; wood chips; and a thermosetting resin adhering the bamboo chips and the wood chips, in which the bamboo chips are blended by 10 to 70 wt.% to the total weight of the bamboo chips and the wood chips, and also provided is a structural member using the particle board.
Inventors:
TAKAISHI YOSHIKI
FUJITA SEIJI
FUKUYA MASASHI
MURAKAMI TOMOYOSHI
FUJITA SEIJI
FUKUYA MASASHI
MURAKAMI TOMOYOSHI
Application Number:
JP2014034447A
Publication Date:
September 03, 2015
Filing Date:
February 25, 2014
Export Citation:
Assignee:
OKURA INDUSTRIAL CO LTD
International Classes:
B27N3/06; B27N3/04
Domestic Patent References:
| JP2014008617A | 2014-01-20 | |||
| JP2003039406A | 2003-02-13 | |||
| JP2006247974A | 2006-09-21 | |||
| JP2009154387A | 2009-07-16 | |||
| JP2007283661A | 2007-11-01 | |||
| JPH10152938A | 1998-06-09 | |||
| JP2014151599A | 2014-08-25 |
Foreign References:
| US20070116940A1 | 2007-05-24 |
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