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Patent Searching and Data


Title:
PARTICULATE SILVER COMPOUND AND USE OF THE SAME
Document Type and Number:
Japanese Patent JP2005200604
Kind Code:
A
Abstract:

To provide a particulate silver compound, capable of forming an electroconductive film having an electric conductivity close to that of metallic silver and excellent in preservation property, an electroconductive film-forming composition, a method for forming the electroconductive film, and the electroconductive film and a circuit formed by the method.

This particulate silver compound reduces the silver compound and causes melting among particles on heating, and is obtained by attaching a 1-8C organic compound on the surface of the particles.


Inventors:
ONO AKINOBU
IGARASHI NAOKO
MIYATA HIROYUKI
TANABE NOBUO
MIZUTANI KIKUKO
Application Number:
JP2004010469A
Publication Date:
July 28, 2005
Filing Date:
January 19, 2004
Export Citation:
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Assignee:
FUJIKURA LTD
International Classes:
C09C3/08; C09C1/00; C09D1/00; C09D5/24; C09D101/00; H01B1/00; H01B1/20; H01B5/14; H01B13/00; (IPC1-7): C09C3/08; C09C1/00; C09D5/24; C09D101/00; H01B1/00; H01B1/20; H01B5/14; H01B13/00
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama