Title:
部品判別装置およびそれを用いた部品実装装置
Document Type and Number:
Japanese Patent JP4523091
Kind Code:
B2
Abstract:
A mounting system for mounting an electronic component on a substrate includes a component identifying apparatus that identifies an electronic component to be mounted on the substrate. The component identifying apparatus includes a holding mechanism that holds the electronic component, a color-perceptive sensor that perceives a color of a predetermined region on the electronic component, and a data processor that identifies the electronic component on the basis of the color perceived by the color-perceptive sensor. The mounting system also includes a controller that controls an electronic component mounting operation on the basis of a result of identification obtained by the component identifying apparatus. The component identifying apparatus carries out the identification of the color of the predetermined region on the electronic component before the electronic component is mounted on the substrate, and the controller executes an operation to cause the electronic component mounting operation to be interrupted when the electronic component is not identified to be a desired one.
Inventors:
Shinichi Ogimoto
Application Number:
JP14075799A
Publication Date:
August 11, 2010
Filing Date:
May 20, 1999
Export Citation:
Assignee:
Shibaura Mechatronics Co., Ltd.
International Classes:
H05K13/08; G02F1/13; G09F9/00; H01L21/60; H05K3/30; H05K13/04
Domestic Patent References:
| JP5145298A | ||||
| JP10163696A | ||||
| JP8152412A | ||||
| JP4342198A | ||||
| JP8254480A |
Attorney, Agent or Firm:
Kenji Yoshitake
Hiroyuki Nagai
Junpei Okada
Hirohito Katsunuma
Hiroyuki Ohno
Hiroyuki Nagai
Junpei Okada
Hirohito Katsunuma
Hiroyuki Ohno