Title:
PARTS FEEDING METHOD
Document Type and Number:
Japanese Patent JP2001341033
Kind Code:
A
Abstract:
To provide a parts feeding method suppressing a unit price of parts and capable of feeding parts even with an adhesive portion by a tray without providing a work process for pasting or peeling release paper.
In this parts feeding method, when mounting a plurality of the parts P having the adhesive portion Pb coated by a semi-hardened sheet-like adhesive B such as thermosetting epoxy resin on the tray T for feeding them in a manufacturing process of a product, the tray T is used with at least a mounting face Ts coated by non-adhesive resin such as silicone and the plurality of the parts P are mounted on the mounting facing Ts for feeding them.
Inventors:
YAMADA AKIHIRO
MATSUNAGA YOSHIAKI
TAMAKI HITOSHI
NAKADA SHINICHI
TSUKADA ATSUSHI
SASANO KEIJI
MATSUNAGA YOSHIAKI
TAMAKI HITOSHI
NAKADA SHINICHI
TSUKADA ATSUSHI
SASANO KEIJI
Application Number:
JP2000163031A
Publication Date:
December 11, 2001
Filing Date:
May 31, 2000
Export Citation:
Assignee:
SONY CORP
International Classes:
B23P19/00; B65D25/02; (IPC1-7): B23P19/00; B65D25/02
Attorney, Agent or Firm:
Osamu Matsumura
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