Title:
部品装着機および部品採取方法
Document Type and Number:
Japanese Patent JP7003277
Kind Code:
B2
Abstract:
A component mounter includes a component supply device, a first determination section, a second determination section, and a timing setting section. The first determination section executes a supply state determination by imaging the component before the component is picked up at a picking up position and determines whether a supply state of the component in the component supply device is appropriate for first components which are a predetermined number of the components smaller than the number of the components supplied from the component supply device to the board. The second determination section determines necessity of the supply state determination for a second component which is the component supplied from the component supply device after the first component is supplied, based on a result of determination by the first determination section. The timing setting section set an operation start timing at which a holding member configured to pick up and hold the component to mount the component on the board starts a lowering operation for picking up the component for both of the first component and the second component.
Inventors:
Kohei Sugihara
Application Number:
JP2020537982A
Publication Date:
January 20, 2022
Filing Date:
August 24, 2018
Export Citation:
Assignee:
Fuji corporation
International Classes:
H05K13/02
Domestic Patent References:
| JP685492A | ||||
| JP200331994A | ||||
| JP201496467A |
Foreign References:
| WO2015029123A1 |
Attorney, Agent or Firm:
Patent business corporation Kyoritsu