Title:
PARTS FOR SEMICONDUCTOR
Document Type and Number:
Japanese Patent JPS5961953
Kind Code:
A
Abstract:
PURPOSE: To enhance junction strength of a chip consisting of the sintered body of a high melting point metal and a metal lead bar by a method wherein the metal lead bar is set in the recession of the chip provided with the recession to the core part.
CONSTITUTION: The chip 2 formed of the sintered body of the high melting point metal material of tungsten, molybdenum, etc., is formed as the cylinder provided with the receission 4 in the axial direction to the core part. The tip part 3a of the lead bar 3 made of copper or a copper alloy is set in the recession 4. Accordingly, the chip 2 and the lead bar 3 are integrated in one body, and the chip of high junction strength is formed.
Inventors:
UMETSU SADAO
Application Number:
JP17266182A
Publication Date:
April 09, 1984
Filing Date:
September 30, 1982
Export Citation:
Assignee:
TOHO KINZOKU KK
International Classes:
H01L23/48; H01L23/49; (IPC1-7): H01L23/48
Domestic Patent References:
JPS5550647A | 1980-04-12 | |||
JPS5179570A | 1976-07-10 |
Attorney, Agent or Firm:
Hiroshi Sugawara
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