Title:
部品供給方法および部品装着装置
Document Type and Number:
Japanese Patent JP7228832
Kind Code:
B2
Abstract:
To provide a component supply device capable of performing lead bending process efficiently, for a taping component holding a lead type component by the tape body.SOLUTION: A component supply device includes a tape feed device 60 for feeding a taping component along a conveyance path, a lead bending device for bending the lead of a component at a bending position 81 provided in the way of the conveyance path, and a lead cutter device 71 for cutting the lead of the component at a cut position on the farther downstream side in the feed direction than the bending position. The lead bending device includes a first mechanism for bending the lead, and a first air cylinder 82 for driving the first mechanism, and the lead cutter device includes a second mechanism for cutting the lead and a second air cylinder 72 for driving the second mechanism, and a common control valve 88 controlling supply and supply stop of air for driving the first and second air cylinders.SELECTED DRAWING: Figure 7
Inventors:
Yousuke Nagasawa
Yokoyama Dai
Shigeki Imafuku
Hideaki Watanabe
Kazuo Nagae
Matsuoka Satoshi
Hiroyuki Suzuki
golden yellow
Yokoyama Dai
Shigeki Imafuku
Hideaki Watanabe
Kazuo Nagae
Matsuoka Satoshi
Hiroyuki Suzuki
golden yellow
Application Number:
JP2018234817A
Publication Date:
February 27, 2023
Filing Date:
December 14, 2018
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H05K13/02; H05K13/04
Domestic Patent References:
| JP61021747U | ||||
| JP6291495A |
Foreign References:
| WO2015198437A1 | ||||
| WO2017056181A1 |
Attorney, Agent or Firm:
Michiko Matsutani
Hiroshi Okabe
Hiroshi Okabe
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