Title:
送受信用受動素子、その集積モジュール及びその製造方法
Document Type and Number:
Japanese Patent JP4879443
Kind Code:
B2
Abstract:
A passive device and module for a transceiver, and a manufacturing method thereof are provided. The passive device includes a semiconductor or a dielectric substrate, at least one capacitor, at least one inductor, a viahole, a metal electrode, radio frequency signals, a radio frequency ground, a packaging substrate. The capacitor is formed on a first surface of the substrate. The inductor is formed on a second surface of the substrate that is opposite to the first surface. The viahole penetrates through the substrate. The metal electrode is formed on the viahole and electrically connects the capacitor on the first surface and the inductor on the second surface. The radio frequency ground is formed on the substrate and isolated from the radio frequency signals. The packaging substrate is bonded on the substrate, having a cavity covering a structure on the bonded surface of the substrate. Also, use of MEMS technique can reduce insertion loss of inductors, which improves the communication quality of the communication systems.
Inventors:
Song Tora
Application Number:
JP2002173451A
Publication Date:
February 22, 2012
Filing Date:
June 13, 2002
Export Citation:
Assignee:
Samsung Electronics Co.,Ltd.
International Classes:
H01F27/00; B81B7/00; H01L27/04; H01F17/00; H01L21/822; H01L23/552; H01L23/66; H01L27/00; H03H7/01; H03H7/075; H03H7/46; H01F17/02
Domestic Patent References:
| JP8097375A | ||||
| JP10098121A | ||||
| JP8274504A | ||||
| JP11251316A | ||||
| JP10092932A | ||||
| JP8222964A |
Foreign References:
| WO2000024124A1 | ||||
| WO1998047340A1 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro