Title:
PASTE APPLICATOR
Document Type and Number:
Japanese Patent JP3469992
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To apply solder paste at a high speed at every electronic part different in the required solder paste coating volume.
SOLUTION: Nozzles and a substrate 7 are relatively moved before and behind as well as left and right while the interval between the nozzle and the substrate is kept constant and, during this period, solder paste is jetted and applied a desired number of times at every wiring pads 7a, 7b, 7c on the substrate 7. Since the solder paste applied to the wiring pads is different in quantity according to the jet coating number of times, even if electronic parts different in the required solder paste coating volume are mounted on the substrate 7, by determining the jet coating number of times at every electronic parts, a required volume of solder paste can be applied at a high speed without altering the nozzles.
Inventors:
Hideo Nakamura
Fukuo Yoneda
Haruo Sankai
Hideo Hatanaka
Minoru Kawabata
Noriaki Mukai
Fukuo Yoneda
Haruo Sankai
Hideo Hatanaka
Minoru Kawabata
Noriaki Mukai
Application Number:
JP16448096A
Publication Date:
November 25, 2003
Filing Date:
June 25, 1996
Export Citation:
Assignee:
株式会社 日立インダストリイズ
株式会社日立製作所
株式会社日立製作所
International Classes:
B05C5/00; H05K3/34; (IPC1-7): B05C5/00
Domestic Patent References:
| JP3142995A | ||||
| JP5200540A | ||||
| JP248166U |
Attorney, Agent or Firm:
Kenjiro Take