Title:
PASTE FOR FILLING THROUGH HOLE AND PRINTED CIRCUIT BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP3415756
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a paste for filling a through hole, hardly causing peeling, etc., of a copper-plated layer from a hardened body formed in a filling step, and suppressing the generation, etc., of crack at a built-up layer, and further to provide a printed circuit board using the same.
SOLUTION: This paste for filling a through hole comprises a metallic filler and an epoxy resin composition. The metallic filler has a spherical shape and is a copper powder, etc., having 0.5-20 μm average particle diameter. Especially, the copper powder subjected to a blackening treatment is preferable. The epoxy resin comprises 70-99 pts.wt. phenol novolak type epoxy resin and 1-30 pts.wt. bisphenol A type and bisphenol F type epoxy resin, and the epoxy resin composition is obtained by adding a hardening agent such as the imidazole-based one to the epoxy resin. Preferably, the heating temperature at a filling step is 120-170°C and the heating temperature at a solder reflow step is 230-280°C.
Inventors:
Yasushi Sumi
Masahiko Okuyama
Masahiko Okuyama
Application Number:
JP32710497A
Publication Date:
June 09, 2003
Filing Date:
November 11, 1997
Export Citation:
Assignee:
Nippon Special Ceramics Co., Ltd.
International Classes:
H05K1/09; C08K3/08; C08K7/18; C08L63/00; C09D5/24; C09J9/02; H01B1/22; H05K3/40; (IPC1-7): C08L63/00; C08K3/08; H01B1/22; H05K1/09; H05K3/40
Domestic Patent References:
| JP11199759A | ||||
| JP8311157A | ||||
| JP8165445A | ||||
| JP5171008A | ||||
| JP4199694A | ||||
| JP8176408A | ||||
| JP10256687A | ||||
| JP1167959A | ||||
| JP7176846A | ||||
| JP9241419A |
Attorney, Agent or Firm:
Kiyomichi Kojima