To obtain a paste for forming a pattern capable of forming a pattern of a large area such as an electrode, a resistor or a dielectric to a uniform thickness with a good accuracy and provide a method for forming the pattern by which the pattern of the large area and the uniform film thickness can be formed of the paste for forming the pattern.

This paste for forming a pattern comprises at least an inorganic component and a resin component capable of volatilizing or decomposing by baking at ≤600°C and the viscosity (η1) at 0.36/sec shear rate regulated to ≤5000P and that (η2) at 36/sec shear rate regulated to ≥50P. The ratio (η1/η2) of the viscosities η1 to η2 is regulated within the range of 1-50. The resultant paste for forming the pattern is used to form a pattern layer 15 on a substrate according to any of a screen printing, an extrusion coating and a die coating methods, removing the resin component in the formed pattern layer 15 in the subsequent baking, fixing the pattern layer 15 to the substrate and forming a desired pattern.