Title:
PASTE FOR FORMING THICK-FILM CONDUCTOR
Document Type and Number:
Japanese Patent JPH04170491
Kind Code:
A
Abstract:
PURPOSE: To obtain the title paste having a reduced Au content and a lowered preparation cost and useful for forming the wiring of a thick-film hybrid IC by mixing a binder with conductive particles having a skin made of Au.
CONSTITUTION: An Ni film 14 is formed on the surface of a conductive particle 12, for example, a copper particle (having a particle diameter of 1-2μm), and a skin comprising an Au film 16 is provided thereon, to which a binder is added to give the title paste.
Inventors:
TERAO YOSHITAKA
SAWAI HIDEO
KOIWA ICHIRO
KOBAYASHI HIROMI
SAWAI HIDEO
KOIWA ICHIRO
KOBAYASHI HIROMI
Application Number:
JP29780890A
Publication Date:
June 18, 1992
Filing Date:
November 02, 1990
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
B22F1/02; C08K9/02; C09J11/04; H01B1/16; H05K1/09; (IPC1-7): B22F1/02; C08K9/02; C09J11/04; H01B1/16; H05K1/09
Attorney, Agent or Firm:
Takashi Ogaki