Title:
PASTE MATERIAL FOR FORMING METALLIC FILM CONTAINING METAL COMPLEX
Document Type and Number:
Japanese Patent JP3738345
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a novel paste material applicable to a base material, such as a thin plastic film, suitable for size and thickness reduction.
SOLUTION: The paste material containing at least one kind of (1) a metal complex having a phosphinic ligand and acetylenic ligand, (2) a metal complex having the phosphinic ligand and organic sulfur ligand, (3) a metal complex having the acetylenic ligand and the organic sulfur ligand and having a quaternary ammonium salt as paired cation and (4) a gold complex containing the organic sulfur ligand and gold at a ratio of 1:1 (molar ratio).
Inventors:
Masami Nakagyo
Akio Harada
Akio Harada
Application Number:
JP2000057720A
Publication Date:
January 25, 2006
Filing Date:
March 02, 2000
Export Citation:
Assignee:
Daiken Chemical Industry Co., Ltd.
Osaka city
Osaka city
International Classes:
C09D1/00; C23C26/00; C09D5/24; H01B1/22; (IPC1-7): C23C26/00; C09D1/00; C09D5/24; H01B1/22
Domestic Patent References:
JP3579765B2 | ||||
JP10279936A | ||||
JP8176037A | ||||
JP11158184A |
Other References:
Allan T Casey, Angelica M Vecchio,The electrochemical synthesis of metallocenes, polymethylmatallocenes, "open metallocenes" and,Applied Organometallic Chemistry,1990年,4,513-522
Attorney, Agent or Firm:
Eiji Saegusa
Kakehi Yuro
Jun Fujii
Kakehi Yuro
Jun Fujii
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