Title:
PASTE NOZZLE FOR DIE BONDING
Document Type and Number:
Japanese Patent JP3779464
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a die bonding paste nozzle which can suppress the infiltration of paste into the upper face of a dice and the occurrence of a void with simple constitution.
SOLUTION: The discharge port 2a of a square opening in a size which is almost matched with the outer form of a dice and an air vent groove 4 connecting the four corners of the discharge port 2a, which are obtained by cutting the opening face of the discharge port 2a, and an outer part are provided at the tip of a nozzle. At the time of applying paste, paste extending in a circle is formed into a dice size and air is set free by the air vent groove 4. Thus, paste is prevented from lacking for the whole dice, paste quantity which comes out from the respective sides of the dice and infiltrates into the upper face of the dice can be reduced and a paste layer without the mix of a void can be formed.
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Inventors:
Yasunaga Tokuhisa
Application Number:
JP5150598A
Publication Date:
May 31, 2006
Filing Date:
February 16, 1998
Export Citation:
Assignee:
New Japan Radio Co., Ltd.
International Classes:
H01L21/52; H05K1/18; B05C5/02; H01L21/60; (IPC1-7): H01L21/52; H01L21/60; H05K1/18
Domestic Patent References:
| JP61145836A |