To form a uniform plating layer having excellent properties on a substrate surface by converging the flow of the plating liquid ejected out of a plating liquid discharge/suction module by shielding plates of a movable anode and supplying the flow on the substrate surface to be plated.

The plating liquid ejected out of the plating liquid discharge/ suction module 1 is supplied to the substrate 3 to be plated via the anode 2 with the shielding plate driven forward and backward in parallel with the substrate 3, by which the substrate is plated. At this time, the flow 15 of the plating liquid ejected out of the plating liquid discharge/suction module 1 is captured by the shielding plates of the anode 2 and is converted to the flow 16 converged by the metallic mesh anode 2b. As a result, the flow 16 of the plating liquid having a sufficient amt. and directivity in combination is acted on the substrate surface to which the metallic mesh anode 2b is diametrically opposed and on which metallic deposition reaction occurs actively. In addition, the regulation of the current distribution in the plating device is made possible and the metallic layer deposited on the substrate surface is evenly grown.