Title:
パターン形成方法、及び電子デバイスの製造方法
Document Type and Number:
Japanese Patent JP6419342
Kind Code:
B2
Abstract:
Provided are: a pattern forming method which exhibits high sensitivity and high resolving power during the formation of an ultrafine pattern; a method for manufacturing an electronic device; and a resist composition. This pattern forming method comprises: a step (1) wherein a film is formed using an active light sensitive or radiation sensitive resin composition that contains (A) a resin which contains a repeating unit represented by general formula (1) in the description and having a ClogP value of 2.2 or less, and the solubility of which in a developer liquid containing an organic solvent is decreased by the action of an acid, (B) a compound which generates an acid when irradiated with active light or radiation, and (C) a solvent; a step (2) wherein the film is exposed to active light or radiation; and a step (3) wherein a negative pattern is formed by developing the film, which has been exposed to light in the step (2), with use of a developer liquid containing an organic solvent.
Inventors:
Akihiro Kaneko
Tomotaka Tsuchimura
Kei Yamamoto
Tomotaka Tsuchimura
Kei Yamamoto
Application Number:
JP2017535283A
Publication Date:
November 07, 2018
Filing Date:
June 30, 2016
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
G03F7/038; C08F246/00; G03F7/004; G03F7/039; G03F7/20
Domestic Patent References:
| JP201441326A | ||||
| JP201441325A | ||||
| JP201424999A | ||||
| JP2003195500A | ||||
| JP200691578A | ||||
| JP61162039A |
Attorney, Agent or Firm:
Patent Business Corporation Koei Patent Office