To provide a pattern forming apparatus flexibly adaptable to a diversified small-quantity production and easily forming a smooth and defect-free pattern on a desired position.
The pattern forming apparatus 155 is provided with a liquid material applying mechanism 110 for applying a liquid material 130 on a substrate 100 and a laser treating mechanism 120 for irradiating the liquid material applied on the substrate 100 with laser beam 121 to solidify the liquid material, wherein a liquid material supply part 113 having an opening part 114 being in contact with the substrate 100 through the liquid material 130 is provided in the liquid material applying mechanism 110, an irradiation part for irradiating an irradiation target point 131 with laser beam is provided in the laser treating mechanism and the liquid material is applied on the substrate 100 from the opening part of the liquid material supply part 113 and sequentially treated with the laser beam emitted from the irradiation part to be solidified.
MIYANISHI SATORU
NOTOHARA YASUHIRO
TANAKA HISAHIRO
Hiroki Naito
Daisuke Nagano