Title:
パターン成形装置及びパターン成形方法
Document Type and Number:
Japanese Patent JP7286561
Kind Code:
B2
Abstract:
To provide an apparatus and a method for reduction of a residual film on a substrate.SOLUTION: A pattern forming apparatus 100 is assembled with: a mold roll 20 which rotates about a shaft as its center and is provided with a recess 21 and a protrusion 22 constituting a pattern 2 on its circumference; a feed recovery mechanism 30 which feeds a resin 5 to the recess 21 on the circumference of the mold roll 20 and also recovers a residue of the resin 5 not having been fed to the recess 21; and a lamp 50 for curing the resin 5 having been fed to the recess 21 and in contact with a base film 1 along a rotation of the mold roll 20 and for integrating with the base film 1. The feed recovery mechanism 30 includes: a feed film 31; a coating die 32 discharging the resin 5 to the feed film 31; and a second transportation mechanism 40 which transports the feed film 31, feeds a part of the resin 5 coated on the feed film 31 to the recess 21 of the circumference of the mold roll 20 and also recovers the residue not having been fed to the recess 21 of the mold roll 20 from the circumference of the mold roll 20.SELECTED DRAWING: Figure 1
Inventors:
Mitsuaki Serizawa
Akihiko Hagiwara
Akihiko Hagiwara
Application Number:
JP2020012818A
Publication Date:
June 05, 2023
Filing Date:
January 29, 2020
Export Citation:
Assignee:
Shibaura Machinery Co., Ltd.
International Classes:
B29C59/04
Domestic Patent References:
| JP57087318A | ||||
| JP2007168094A |
Foreign References:
| KR101062128B1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Goto Patent Office