To provide a pattern forming method which can simply decrease the error of alignment between a plurality of layers, and reduce an environmental load and an electronic device manufacturing method.

The method for forming a layer structure pattern by a plurality of the layers includes: the first process in which a three-dimensional mold having a multi-stage uneven shape corresponding to a plurality of the layers is used, and the reversed multi-stage uneven shape of the three-dimensional mold is formed on a substrate; the second process in which a liquid material is charged in a recess in the multi-stage uneven shape formed on the substrate by a liquid utilization method to form a layer of a plurality of the layers; and the third process in which the second process is repeated by the residual layers portion excluding one layer portion formed in the second process in a plurality of the layers to form the residual layers.