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Patent Searching and Data


Title:
PATTERN FORMING METHOD AND MANUFACTURING APPARATUS OF ELECTROLYTE FILM FOR PATTERN FORMATION USED IN THE METHOD
Document Type and Number:
Japanese Patent JP2006103178
Kind Code:
A
Abstract:

To provide a pattern forming method which can form a uniformly thin film having an thickness of not more than 100 nm applicable to lithography using nanoimprint for patterning in not more than 100 nm and can be applied to nanoimprint, and to provide a manufacturing apparatus of an electrolyte film for pattern formation which can realize such a method.

The pattern forming method comprises a process of forming a resin layer on a substrate, a process of pressing a mold with a pattern on the resin layer and a process of separating the mold from the substrate, and the process of forming the resin layer includes the step of forming at least two electrolyte layers on the substrate by adsorption.


Inventors:
MURAKAMI TAIJI
Application Number:
JP2004293624A
Publication Date:
April 20, 2006
Filing Date:
October 06, 2004
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B29C59/02; B05C3/18; B05D3/12; H01L21/027