パターン形成方法及びパターン形成装置、並びにデバイス製造方法

Title:

パターン形成方法及びパターン形成装置、並びにデバイス製造方法

Document Type and Number:

Japanese Patent JP5472331

Kind Code:

B2

Abstract:

A plurality of marks on a wafer (W) are detected while a wafer stage (WST) moves from a loading position where the wafer (W) is delivered onto the wafer stage (WST) to an exposure starting position where exposure of the wafer (W) begins, with at least a part of an alignment system (ALG1, ALG2) also being moved, using the alignment system (ALG1, ALG2). Accordingly, the time required for mark detection can be reduced, therefore, it becomes possible to increase the throughput of the entire exposure process.

Inventors:

Yuichi Shibasaki

Application Number:

JP2012007301A

Publication Date:

April 16, 2014

Filing Date:

January 17, 2012

Export Citation:

Click for automatic bibliography generation Help