Title:
PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JPH01134917
Kind Code:
A
Abstract:
PURPOSE:To contrive accomplishment of formation of highly precise pattern by a method wherein a hardened layer is formed on the region ranging from one main surface of a resist to the prescribed depth by conducting a second irradiation via a second mask on the transfer pattern formed in the resist, and a pattern of cross-sectional form is obtained. CONSTITUTION:When a first irradiation 13 of a prescribed strength is conducted from the side of the mask substrate 12a of a first mask 12, the pattern on the mask 12 is transferred to a resist 2. The region of the resist 2 is exposed by the irradiation light which passed through a light transmitting part 12c. The transfer pattern 11 of the exposed part 11b, which becomes a boundary, and the non-exposed part 11a are formed. A second irradiation 16 in a prescribed intensity is conducted from the side of the mask substrate 15a of a second mask 15, and a prescribed region of the transfer pattern 11 is projected. The light passed through the light-transmitting part 15c by the second irradiation 16 is projected to a non-exposed part 11a. A hardening reaction is generated on the resist 2, and the first hardened layer 14 is formed. As a result, the highly precise pattern can be obtained.
Inventors:
OGAWA SACHIKO
KAWAI AKIRA
KISHIMURA SHINJI
MIYAZAKI JUNJI
KAWAI AKIRA
KISHIMURA SHINJI
MIYAZAKI JUNJI
Application Number:
JP29351987A
Publication Date:
May 26, 1989
Filing Date:
November 19, 1987
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G03F7/20; H01L21/027; H01L21/30; (IPC1-7): G03F7/20; H01L21/30
Domestic Patent References:
| JPS53130030A | 1978-11-13 | |||
| JPS57109949A | 1982-07-08 | |||
| JPS5834922A | 1983-03-01 |
Attorney, Agent or Firm:
Mamoru Takada (1 person outside)
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