PATTERN FORMING PASTE AND METHOD FOR FORMING PATTERN

Japanese Patent JP3920944

B2

PROBLEM TO BE SOLVED: To provide a pattern forming paste which can form a high-definition pattern of electrodes, resistors, dielectrics, and the like and a pattern forming method which enables formation of a high-accuracy pattern of electrodes, resistors, dielectric, and the like.
SOLUTION: A pattern forming paste contains at least inorganic powders and a resin component which volatilizes or decomposes when baked at 600°C or lower, and has a dynamic coefficient of viscosity of 500 to 7,000 poise and a loss tangent (tanδ) of 5 to 12. In a first process, the pattern forming paste is formed into a predetermined pattern 4 on a surface lubricant layer 3 which an intermediate transfer medium 1 has on one side of a base 2 and which is composed chiefly of polydimethyl siloxane. Next in a second process, the pattern 4 on the intermediate transfer medium 1 is transferred onto a base S to form a pattern layer 5. Thereafter in a third process, baking at 500 to 600°C is effected to remove the resin components in the pattern layer 5 and to secure the pattern layer 5 to the base 2 to form a pattern layer P.

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Satoru Kuramochi

JP12400396A

May 30, 2007

April 22, 1996

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Dai Nippon Printing Co.,Ltd.

B41M1/10; H01B1/20; H05K1/09; H05K3/20; (IPC1-7): H01B1/20; B41M1/10; H05K1/09; H05K3/20

JP4012501A
JP6139815A

Junzo Yoneda
Hideo Sarada
Yoko Hasegawa

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