Title:
PATTERN INSPECTION DEVICE AND PATTERN INSPECTION METHOD
Document Type and Number:
Japanese Patent JP2016173247
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern inspection device capable of inspecting defects of a pattern with high accuracy and a pattern inspection method.SOLUTION: The pattern inspection device has an imaging part 10 and a generation part 50. The imaging part 10 images a second pattern of an inspection object (enlarged copy template 130) which is acquired by enlarging the inspection object having a first pattern. A determination output part 60 outputs positional information other than a predicted position of a first defect generated when enlarging the inspection object from positional information of the first or the second pattern corresponding to a different point between a reference image generated by design data of the first pattern and a picked-up image generated by the imaging part 10.SELECTED DRAWING: Figure 1
Inventors:
YOSHIKAWA RYOJI
TOKI TATSUHIKO
MORITA SEIJI
HIRANO TAKASHI
TOKI TATSUHIKO
MORITA SEIJI
HIRANO TAKASHI
Application Number:
JP2015052147A
Publication Date:
September 29, 2016
Filing Date:
March 16, 2015
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
G01N21/956; B29C59/02; G01N21/84; G01N21/93; G03F1/84
Attorney, Agent or Firm:
Hirohito Katsunuma
Takeshi Sekine
Akaoka Akira
Takeshi Sekine
Akaoka Akira