Title:
PATTERNING METHOD
Document Type and Number:
Japanese Patent JPS5984427
Kind Code:
A
Abstract:
PURPOSE:To prevent the decline of resolution by coating resist on two layers through an altered layer resulting in thickly coating thereby reducing degree of pattern width variability at stepped part. CONSTITUTION:Positive resist 7 is coated on a substrate 1 more thickly than thickness of a film at a stepped part 2. Next, the resist 7 is irradiated with ultraviolet rays 10 to become photosensitive positive resist 7a. Then a positive resist altered layer 7b is formed on the layer 7a. Next, positive resist 8 which is of same type as the resist 7 is coated on the layer 7b. Then the resists 7 and 8 are selectively irradiated except a light shielded part 9a with ultraviolet rays by use of a mask having a pattern, and are removed by exposure leaving positive resists 8a, 7c and 7d which were not irradiated with ultraviolet rays. These steps in series enables to form precise patterns in spite of thick coating of resists as well as to reduce variation in dimensions at stepped parts.
Inventors:
SASAKO MASARU
TSUJI KAZUHIKO
TSUJI KAZUHIKO
Application Number:
JP19411182A
Publication Date:
May 16, 1984
Filing Date:
November 04, 1982
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
G03F7/38; G03F7/09; G03F7/26; H01L21/027; (IPC1-7): H01L21/30
Attorney, Agent or Firm:
Akira Kobiji (2 outside)
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