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Title:
PATTERNING OF UNEVEN SURFACE OF UNEVEN BOARD
Document Type and Number:
Japanese Patent JPS5450071
Kind Code:
A
Abstract:

PURPOSE: To obtain an uneven board having a surface pattern free from heat deterioration or loss of strength, by pressing the bend part of a synthetic resin board having uneven bend part, extruded from a mold, between an embossing roll and a smooth roll, and by recovering the bend part to an uneven form.

CONSTITUTION: The synthetic resin board material 2 having the uneven bend part 1 is extruded from the mold 3. The uncured material 2 is pressed between the embossing roll 4 having an uneven pattern and the smooth roll 5 at a temperature of 100W150°C under a pressure of 5W50 kg/cm2, and patterned while being flattened resisting the self elasticity, then recorved to the original unenen shape by sucking the interior of the board material 2 with the sizing die 6


Inventors:
FUKI HIDEO
Application Number:
JP11640777A
Publication Date:
April 19, 1979
Filing Date:
September 27, 1977
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B29B7/00; B29C48/30; B29C48/90; B29C69/02; B29C48/08; B29C48/12; (IPC1-7): B29F3/00
Domestic Patent References:
JP45040796A