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Title:
PAVEMENT STRUCTURE
Document Type and Number:
Japanese Patent JP3170464
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To cool paving laid on a substrate, by laying a water-permeable pavement material on a substrate and embedding pipes which can permeate a coolant in the inside of the pavement material.
SOLUTION: A pavement material 11 is laid on a substrate to form a paving structure. The pavement material 11 is constituted of water-permeable asphalt, water-permeable concrete, water-permeable resin, etc., in which aggregate with a specified granular size are combined by a synthetic resin binder. A plurality of pipes 20, 30 are selectively laid down in the pavement material 11. The pipe 20 is made of a polyvinyl chloride cylinder with a circular section and a number of holes 21 are made at every specified distance on the peripheral face. One end side of the pipe 20 is connected to a cooling water source like water source. Accordingly, when a cooling water is led from the water source into the the inside of the pipe 20, the cooling water is discharged in the pavement material 11. In this way, the excessive surface temperature rise of the pavement material is prevented.


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Inventors:
Kazuhiko Kobayashi
Yoshihisa Mizumoto
Takehito Matsuki
Kazusuke Iwasaki
Hiroshi Hasegawa
Application Number:
JP26793896A
Publication Date:
May 28, 2001
Filing Date:
September 18, 1996
Export Citation:
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Assignee:
Sumitomo Rubber Industries, Ltd.
International Classes:
A63C19/00; E01C13/00; E01C13/08; (IPC1-7): E01C13/08
Domestic Patent References:
JP8209613A
JP5272109A
JP9191780A
JP5760908U
JP1105604U
Attorney, Agent or Firm:
Takuya Ohhara