Title:
PEELING DEVICE
Document Type and Number:
Japanese Patent JP2023003324
Kind Code:
A
Abstract:
To provide a peeling device which can prevent device contamination caused by peeling debris produced when peeling a wafer from an ingot.SOLUTION: A peeling device 100 has: an ingot holding unit 110 which has a holding surface 111 for holding an ingot 10; a wafer holding unit 120 which is capable of coming closer to and going away from the ingot holding unit 110, and which has a holding surface 121 for sucking and holding a wafer 30 to be produced; a washing brush 130 which washes peeling surfaces 23 and 31, where the wafer 30 to be produced has been peeled from the ingot 10, so that peeling debris may be removed; and a moving unit 140 which brings the washing brush 130 into contact with at least one of the peeling surface 23 of the ingot 10 held by the ingot holding unit 110 or the peeling surface 31 of the wafer 30 held by the wafer holding unit 120, and moves them relative to each other.SELECTED DRAWING: Figure 5
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Inventors:
HONOKI KOYO
YAMAMOTO RYOHEI
YAMAMOTO RYOHEI
Application Number:
JP2021104428A
Publication Date:
January 11, 2023
Filing Date:
June 23, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/304; B23K26/53; B24B29/00
Attorney, Agent or Firm:
Sakai International Patent Office
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