Title:
PEELING METHOD
Document Type and Number:
Japanese Patent JP2017022188
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a peeling method capable of industrially advantageously peeling a film from a substrate.SOLUTION: Provided is a method of peeling off a film formed on a substrate from the substrate by containing hydrogen at or near the interface between the substrate and the film, the method comprising: atomizing or dropletizing a raw material of a hydrogen content and a film formation; transporting the resulting mist or droplet to the substrate with a carrier gas; and thermally reacting the mist or droplet on the substrate to form a film.SELECTED DRAWING: None
Inventors:
ODA SHINYA
TOKUTA RIE
HITORA TOSHIMI
TOKUTA RIE
HITORA TOSHIMI
Application Number:
JP2015136543A
Publication Date:
January 26, 2017
Filing Date:
July 07, 2015
Export Citation:
Assignee:
FLOSFIA INC
International Classes:
H01L21/365; C23C16/44; C23C16/56; H01L21/02; H01L21/86
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