剥離基板製造方法

Japanese Patent JP7007656

B2

To provide a method for manufacturing a peeling substrate, which can suppress the occurrence of a crack in a crystal material, and which enables the stable formation of a processing layer.SOLUTION: A method for manufacturing a peeling substrate comprises the steps of: forming a processing layer on a substrate 10, including a laser-focusing step of focusing a laser beam at a predetermined depth from a surface of the substrate 10, and a positioning step of performing a positioning action by relatively moving a laser beam-focusing part 160 with respect to the substrate 10; and preparing the peeling substrate by peeling the substrate 10 with the processing layer formed therein at the processing layer. The laser-focusing step includes a laser beam-adjustment step of using a diffractive optical element 170 serving to branch a laser beam into a plurality of branch laser beams to branch the laser beam so that at least one branch laser beam differs from the other branch laser beams in intensity. Using of the plurality of branch laser beams, a branch laser beam having a higher intensity, the processing layer is caused to extend to process the substrate 10; and the extension of the processing layer is suppressed by a branch laser beam having a lower intensity.SELECTED DRAWING: Figure 1

Junichi Ikeno
Youhei Yamada
Suzuki Hideki
Rika Matsuo

JP2020174574A

January 24, 2022

October 16, 2020

Click for automatic bibliography generation  

Saitama University
Shin-Etsu Polymer Co., Ltd.

B23K26/00; H01L21/304; B23K26/067; B23K26/53; C30B29/36; C30B33/04; C30B33/10

JP2015123466A
JP2012146878A
JP2013224974A
JP2014160753A
JP2015012124A

CN102569055A

Hidekazu Miyoshi
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu

Previous Patent: Elevator doors and elevators

Next Patent: Beaconing in small wavelength wireless networks