Title:
ペリクル接着剤残留物除去システムおよび方法
Document Type and Number:
Japanese Patent JP7348264
Kind Code:
B2
Abstract:
Embodiments of the present disclosure generally include apparatus and methods for removing adhesive residues from a surface of a lithography mask. In particular, the processing systems described herein provide for the delivery of a solvent to a discrete plurality of locations on the surface of the lithography mask to facilitate the removal of adhesive residue therefrom. In one embodiment, a method of processing a substrate includes positioning the substrate on a substrate support of a processing system, sealing individual ones of a plurality of cleaning units to a surface of the substrate at a corresponding plurality of locations, heating a cleaning fluid to a temperature between about 50° C. and about 150° C., flowing the cleaning fluid to, and thereafter, from, the plurality of cleaning units, and exposing the surface of the substrate to the cleaning fluid at the plurality of locations.
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Inventors:
wu banchiu
Dagan Eli
Dagan Eli
Application Number:
JP2021503098A
Publication Date:
September 20, 2023
Filing Date:
June 25, 2019
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
G03F1/82; G03F1/24; G03F1/62; H01L21/304
Domestic Patent References:
| JP2016031412A | ||||
| JP2002124501A | ||||
| JP2012212032A | ||||
| JP2010243796A |
Foreign References:
| US6103636 | ||||
| US20180031962 | ||||
| US20040197433 | ||||
| US5271798 | ||||
| WO2018091604A1 | ||||
| US20120219654 |
Attorney, Agent or Firm:
Shinichiro Tanaka
▲吉▼田 和彦
Hiroyuki Suda
Fumiaki Otsuka
Takayoshi Nishijima
Hiroshi Uesugi
Naoki Kondo
Takeo Nasu
Yoshiaki Kudo
▲吉▼田 和彦
Hiroyuki Suda
Fumiaki Otsuka
Takayoshi Nishijima
Hiroshi Uesugi
Naoki Kondo
Takeo Nasu
Yoshiaki Kudo