Title:
貫通電極基板及び半導体装置
Document Type and Number:
Japanese Patent JP7327612
Kind Code:
B2
Abstract:
A through electrode substrate includes: a substrate having a first surface and a second surface facing the first surface; through electrodes penetrating through the substrate; and a first capacitor including a first conductive layer, an insulating layer, and a second conductive layer, arranged on the first surface side of the substrate, and electrically connected with at least one of the through electrodes. The first conductive layer is arranged on the first surface side of the substrate and is electrically connected with the through electrode. The insulating layer includes a first part and a second part and is arranged on the first conductive layer. The second conductive layer is arranged on the insulating layer. The first part is arranged between the first conductive layer and the second conductive layer. The second part covers at least a part of a side surface of the first conductive layer.
Inventors:
Takano Takano
Satoru Kuramochi
Satoru Kuramochi
Application Number:
JP2022150556A
Publication Date:
August 16, 2023
Filing Date:
September 21, 2022
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H01L23/12; H05K1/16; H05K3/46
Domestic Patent References:
| JP200471872A | ||||
| JP200624902A | ||||
| JP2000223316A | ||||
| JP2009295843A | ||||
| JP11260148A |
Foreign References:
| WO2003007379A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Takahashi Hayashi and Partners
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