Title:
浸透構造体
Document Type and Number:
Japanese Patent JP4811668
Kind Code:
B2
Inventors:
Kunio Togashi
Application Number:
JP2007163928A
Publication Date:
November 09, 2011
Filing Date:
June 21, 2007
Export Citation:
Assignee:
Erdec Corporation
International Classes:
E03F1/00
Domestic Patent References:
| JP55081182U | ||||
| JP2000064407A | ||||
| JP62066984U | ||||
| JP53046378B2 | ||||
| JP55140567U | ||||
| JP62099533A | ||||
| JP2004218308A |
Attorney, Agent or Firm:
Calyx
Toshio Nakamura
Miyazaki Yoshio
Kaoru Onozuka
Toshio Nakamura
Miyazaki Yoshio
Kaoru Onozuka