Title:
フェノール系重合体、その製法及びその用途
Document Type and Number:
Japanese Patent JP5170493
Kind Code:
B2
Abstract:
A method of sealing a semiconductor element which involves applying an epoxy resin composition including an epoxy resin and a phenolic resin obtained by reacting phenol, a biphenyl compound represented by the general formula (3) and benzaldehyde to a semiconductor element and curing the composition to seal the semiconductor element: wherein X in the formula (3) is a halogen, an OH group or an OCH3 group. The molar ratio of the total of the biphenyl compound and benzaldehyde relative to the phenol is from 0.27 to 0.40, and the molar ratio of benzaldehyde/biphenyl compound is from 5/95 to 40/60.
Inventors:
Kiyotaka Murata
Yoshihisa Sone
Yoshihisa Sone
Application Number:
JP2005300126A
Publication Date:
March 27, 2013
Filing Date:
October 14, 2005
Export Citation:
Assignee:
Air Water Inc.
International Classes:
C08G59/62; C08G14/04; C08G61/02; H01L23/29; H01L23/31
Domestic Patent References:
| JP11279265A | ||||
| JP6184258A | ||||
| JP9157353A | ||||
| JP2000212259A | ||||
| JP2001064340A | ||||
| JP5117350A |
Attorney, Agent or Firm:
Shigemitsu Nakajima
Kazu Yamaguchi
Kazu Yamaguchi