Title:
PHENOLIC RESIN, EPOXY RESIN, EPOXY RESIN COMPOSITION AND ITS CURED PRODUCT
Document Type and Number:
Japanese Patent JP2009108147
Kind Code:
A
Abstract:
To provide an epoxy resin giving a cured product having flame retardancy, a phenolic resin as a raw material of the epoxy resin, and an epoxy resin composition containing the epoxy resin.
An aromatic hydrocarbon formaldehyde resin, such as mesitylene-formaldehyde resin, xylene-formaldehyde resin, toluene-formaldehyde resin and naphthalene-formaldehyde resin, is reacted with a mixture of naphthol and phenol to obtain a novolac type phenolic resin, which is further reacted with epihalohydrin to obtain the epoxy resin.
Inventors:
KAWAI KOICHI
OSHIMI KATSUHIKO
NAKANISHI MASATAKA
SUNAGA TAKAO
OSHIMI KATSUHIKO
NAKANISHI MASATAKA
SUNAGA TAKAO
Application Number:
JP2007279899A
Publication Date:
May 21, 2009
Filing Date:
October 29, 2007
Export Citation:
Assignee:
NIPPON KAYAKU KK
International Classes:
C08G8/08; C08G59/24
Domestic Patent References:
| JPH10120869A | 1998-05-12 | |||
| JPH07196766A | 1995-08-01 | |||
| JPH05148333A | 1993-06-15 | |||
| JP2005171188A | 2005-06-30 | |||
| JPH1017636A | 1998-01-20 |
Previous Patent: HOLLOW RESIN PARTICLE AND ITS MANUFACTURING METHOD
Next Patent: METHOD FOR PRODUCING CHITOSAN FINE PARTICLE
Next Patent: METHOD FOR PRODUCING CHITOSAN FINE PARTICLE