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Title:
PHENOLIC RESIN MOLDING COMPOUND
Document Type and Number:
Japanese Patent JP2006199895
Kind Code:
A
Abstract:

To provide a phenolic resin molding compound substantially equivalent to or better than conventional such molding compounds in mechanical properties, but small in anisotropic difference for coefficient of linear expansion.

The phenolic resin molding compound comprises the phenolic resin, tectosilicates and inorganic fillers which comprise glass fibers and inorganic fillers at least one kind selected from talc, clay, calcium carbonate and wollastonite excluding glass fibers. Wherein the preferable tectosilicates is at least one selected from orthoclase, albite and anorthite, and contained 3-30 wt.%. to the total resin compound.


Inventors:
TSURUTA TADATOSHI
Application Number:
JP2005015974A
Publication Date:
August 03, 2006
Filing Date:
January 24, 2005
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L61/06; C08K3/34; C08K7/14; H02K13/00