To obtain a phenolic resin molding material which is excellent in heat stability and curability, can be molded with low pressure and can give a molded article with little occurrence of flash by using a specified phenolic resin molding material.

This molding material consists of a resol phenolic resin with a number-average molecular weight of 300 to 500, a low-molecular polyolefin compound preferably comprising a polyethylene with a molecular weight of 500 to 1,500, and a filler.