Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PHENOLIC RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JPH0940843
Kind Code:
A
Abstract:

To obtain a phenolic resin molding material capable of being injection molded under a row pressure, having excellent fluidity, heat stability and curability at a high temperature and useful for electric members, etc., by comprising a specific phenolic resin, monohydric aliphatic alcohols, hexamethylene tetramine, etc.

This molding material is composed of (A) 100 pts.wt. of a phenolic resin such as a high ortho-novolak type phenolic resin having 350-500 number average molecular weight and 1.5-2.5 ortho/para bonding ratio, (B) preferably 1-20 pts.wt. of monohydric aliphatic alcohols having ≤5C chain and 80-140°C boiling point such as amino alcohol, (C) preferably 12-20 pts.wt. of hexamethylene tetramine, (D) preferably 0.1-10 pts.wt. of a low-molecular weight polyolefin compound such as PE having 500-1,500 molecular weight and (E) a filler such as wood powder.


Inventors:
ISHIDA TAMOTSU
YAMOTO MASATOSHI
Application Number:
JP18960395A
Publication Date:
February 10, 1997
Filing Date:
July 25, 1995
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08K5/05; C08K5/3447; C08L23/06; C08L59/00; C08L61/04; C08L61/06; (IPC1-7): C08L61/06; C08K5/05; C08K5/3447; C08L23/06