Title:
シール剤用光硬化型樹脂組成物およびシール方法
Document Type and Number:
Japanese Patent JP4193343
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a photocuring resin composition for sealant, capable of being cured at a low temperature, excellent in photosensitivity, rapidly curing properties and adhesion, giving high adhesive strength and resistance to moisture permeability to a cured product, giving good productivity, and capable of being suitably used for a flat panel display, such as a liquid crystal display and an electroluminescent display, to obtain a sealant containing the composition, and to provide a sealing method by using the sealant. SOLUTION: This photocuring resin composition for sealant contains (A) a compound having an oxetane ring, (B) a cationic photopolymerization initiator, and (C) a silane coupling agent, and has a viscosity of 0.01-300 Pa.s at 25 deg.C. The sealant containing the photocuring resin composition is used for sealing the liquid crystal display, the electroluminescent display, or the like.
Inventors:
Takamatsu Yasushi
Katsura Nagata
Masahiro Ota
Koji Paddy
Yoshio Kikuta
Katsura Nagata
Masahiro Ota
Koji Paddy
Yoshio Kikuta
Application Number:
JP2000249197A
Publication Date:
December 10, 2008
Filing Date:
August 11, 2000
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
C09K3/10; G02F1/1339; B05D7/00; B05D7/24; C08G65/18; H05B33/04
Domestic Patent References:
| JP2000264955A | ||||
| JP11209599A |
Attorney, Agent or Firm:
Shigeru Yanagihara