To provide a photobase generator achieving both of improvement in photosensitive performance by shifting an absorption wavelength for light to a longer wavelength and improvement in heat-resistant stability, to provide a photosensitive resin composition for improving mechanical properties of a film by using the photobase generator, which is difficult to achieve with a conventional photobase generator, and to provide a circuit board using the composition.

The photobase generator is a compound containing an acyloxy imino group expressed by formula (1). The photosensitive resin composition contains a photobase generator (A) and a polyamide acid (B), wherein the photobase generator is a compound containing an acyloxy imino group expressed by formula (1). In the formula, X1 represents a divalent organic group; n represents an integer of 1 to 5; and R1 represents an aromatic group or an alkyl group having 1 or more carbon atoms.