Title:
電極被覆用光硬化型組成物
Document Type and Number:
Japanese Patent JP5407646
Kind Code:
B2
Abstract:
To provide a photocurable composition for covering an electrode which is excellent in electric insulation and ion migration resistance in particular and has moisture curability formable of a sufficient cured film.
The photocurable composition for covering the electrode comprises a urethane (meth)acrylate oligomer (A), a compound (B) having an alkyl groups of ≥8C or a cycloalkyl group of ≥8C and a (meth)acryloyl group in a molecule, a compound (C) having two or more isocyanate groups in a molecule, a moisture curing catalyst (D) and a photopolymerization initiator (E).
COPYRIGHT: (C)2011,JPO&INPIT
Inventors:
Hisao Kato
Hiroi Oikawa
Yasuyuki Sanai
Eiichi Okazaki
Hiroi Oikawa
Yasuyuki Sanai
Eiichi Okazaki
Application Number:
JP2009181668A
Publication Date:
February 05, 2014
Filing Date:
August 04, 2009
Export Citation:
Assignee:
Toagosei Co., Ltd.
International Classes:
H01B3/30; C08F290/06; C08G18/70; C09D4/02; C09D5/00; C09D7/12; C09D175/16; H01B3/44; H01L23/29; H01L23/31; H05K3/28
Domestic Patent References:
| JP2005317523A | ||||
| JP6073313A | ||||
| JP2008280414A | ||||
| JP8176247A |
Foreign References:
| WO2009063912A1 |