Title:
光硬化性組成物、これを用いた硬化物パターンの製造方法、光学部品の製造方法、回路基板の製造方法
Document Type and Number:
Japanese Patent JP6624808
Kind Code:
B2
Abstract:
A photocurable composition contains a polymerizable compound; and a photopolymerization initiator, in which the photocurable composition contains a compound represented by General Formula (1) shown below as the polymerizable compound, and in which, in General Formula (1), Ar represents a monovalent aromatic group which may have a substituent, R1 represents an alkyl group which may have a substituent or a hydrogen atom, R2 represents an alkyl group having (m + n) valences which may have a substituent, m is an integer of 2 or more, and n is an integer of 1 or more.
Inventors:
Toshiki Ito
Takeshi Honma
Yonezawa Shiori
Satoshi Otani
Kazumi Sakamoto
Takeshi Honma
Yonezawa Shiori
Satoshi Otani
Kazumi Sakamoto
Application Number:
JP2015099486A
Publication Date:
December 25, 2019
Filing Date:
May 14, 2015
Export Citation:
Assignee:
Canon Inc
International Classes:
C08F20/18; C08F2/50; H01L21/027
Domestic Patent References:
| JP51043374B1 | ||||
| JP2013189537A | ||||
| JP2012072269A | ||||
| JP2013538239A | ||||
| JP2014078697A |
Foreign References:
| WO2014087817A1 |
Attorney, Agent or Firm:
Takuma Abe
Sogo Kuroiwa
Sogo Kuroiwa