PHOTOCURABLE RESIN COMPOSITION AND PRODUCTION OF RESIN MOLD

Japanese Patent JP3820289

B2

PROBLEM TO BE SOLVED: To obtain a photocurable resin composition which can give a cured product having an excellent heat resistance by mixing a compound having a cyclohexene oxide structure with a cationic photopolymerization initiator, an ethylenically unsaturated monomer, a radical photopolymerization initiator and spherical silica particles.
SOLUTION: 5-60wt.% 3,4-epoxycyclohexylmethyl-3',4'- epoxycyclohexanecarboxylate, 0.1-10wt.% cationic photopolymerization initiator (e.g. hexafluoroantimonate), 1-30wt.% ethylenically unsaturated monomer (e.g. trimethylolpropane triacrylate) and 0.01-8wt.% radical polymerization initiator (e.g. 1-hydroxycyclohexyl phenyl ketone) are fed into an agitating vessel and agitated at about 50°C for about 2hr to obtain a homogeneous resin solution. This solution is mixed with 40-80wt.% spherical silica particles having a mean particle diameter of 1-50μm to obtain a photocurable resin composition having a viscosity of 1,000-10,000cP. This composition is molded and cured by irradiation with light to obtain a cured product having a heat distortion temperature of 100°C or above.

JPH0610232	[Title of the Invention] A method for producing a glycidyl ether of a bromine-containing novel fuel resin.
JPS5918725	LOW-SHRINKAGE THERMOSETTING RESIN COMPOSITION

Takeshi Watanabe
Yuichi Haruta
Hideaki Takase
Takashi Ukachi

JP25058496A

September 13, 2006

September 20, 1996

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JSR CORPORATION
Nippon Special Coating Co., Ltd.

C08G59/00; G03F7/004; B29C33/40; C08F2/44; C08F2/48; C08G65/10; G03F7/00; G03F7/027; G03F7/029; G03F7/038; (IPC1-7): C08G65/10; B29C33/40; C08F2/44; C08F2/48; G03F7/004; G03F7/029

JP2080422A
JP2075618A

Masahiko Oi

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